View UPC2807_119859.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

DATA SHEET
BiCMOS INTEGRATED CIRCUIT
PC2807,2807A
PREAMPLIFIER FOR INFRARED REMOTE CONTROLLER
DESCRIPTION
The PC2807 and 2807A are semiconductors integrated circuit developed as preamplifiers for the receiver module of infrared remote controllers. These preamplifiers can be directly connected to a PIN photodiode, and integrate a high-gain first stage amplifier, limiter, bandpass filter, detector circuit, and waveform-shaping circuit on a single chip.
FEATURES
* Only PIN photodiode required as an external component. * Following carrier frequencies (fO) selectable (five types):
PC2807
: fO = 32.7, 36.0, 36.7, 37.9 kHz
PC2807A : fO = 40.0 kHz
* Fixed trap frequency fT = 54 kHz * Active-low output * Supplied in form of wafer
APPLICATION
* Receiver module of infrared remote controller
ORDERING INFORMATION
Part Number Condition in shipment Wafer Wafer
PC2807W PC2807AW
Contact an NEC sales representative in advance since a memorandum on product quality need to be prepared for shipment in the form of wafer.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. S13198EJ1V0DS00 (1st edition) Date Published May 2000 NS CP (K) Printed in Japan
The mark 5 shows major revised points. 1998, 2000
PC2807, 2807A
BLOCK DIAGRAM
VCC 6 ABLC First-stage Limiter amplifier amplifier TRAP BPF Detector PAD1 3 Waveform-shaping circuit 22 k 5 OUT
IN
9
I/V
Carrier elimination TRAP skip Trimming circuit fO setting
13
12
11
10
4 S3
2 S2
1 S1
8
7
PAD6 PAD4 PAD5 PAD3
GND2 GND1
2
Data Sheet S13198EJ1V0DS00
PC2807, 2807A
PAD FUNCTION
Symbol VCC Pad No. 6 Function Power pad. Apply a voltage of 5 V 10 %. Connect an external smoothing filter if noise on power line is high. GND1 GND2 IN OUT 7 8 9 5 GND pad (for output transistor) GND pad (for circuits excluding output transistor) Input pad. Internal impedance is 190 k TYP. PIN photodiode can be directly connected. Output pad. Open-collector output with pull-up resistor (22 k TYP.) To connect pull-up resistor, use resistor of 10 k or higher. S1 S2 S3 PAD1 1 2 4 3 BPF output pad. Parameters such as voltage gain and BPF bandwidth can be tested. Do not connect this pad to anything on final assembly. PAD3 PAD4 PAD5 PAD6 10 11 12 13 Test and trimming pads. Do not connect these pads to anything. BPF center frequency setting pads. Connect pad corresponding to carrier frequency to be used to GND
Note
.
Note Connect each of BPF center frequency setting pads as follows depending on the carrier frequency.
* PC2807
Carrier Frequency 32.7 kHz 36.0 kHz 36.7 kHz 37.9 kHz GND GND Leave unconnected. Leave unconnected. S1 S2 Leave unconnected. GND GND Leave unconnected. S3 Leave unconnected. GND GND Leave unconnected.
* PC2807A
Carrier Frequency 40.0 kHz S1 Leave unconnected. S2 Leave unconnected. S3 Leave unconnected.
Data Sheet S13198EJ1V0DS00
3
PC2807, 2807A
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = +25 3 C)
Parameter Supply voltage Output sink current Input voltage Storage temperature Symbol VCC IOSINK VIN Tstg Ratings 5.5 2.5 0 to VCC -40 to +125 Unit V mA V C
Caution
Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded.
Recommended Operating Conditions (TA = 25 3 C)
Parameter Supply voltage Operating ambient temperature Symbol VCC TA Conditions MIN. 4.5 -25 TYP. 5.0 +25 MAX. 5.5 +80 Unit V C
4
Data Sheet S13198EJ1V0DS00
PC2807, 2807A
Electrical Characteristics (TA = +25 3 C, VCC = 5 V)
Parameter Circuit current Symbol ICC Conditions With no signal applied. S1. S2, and S3: Leave unconnected. Low-level output voltage 1 Low-level output voltage 2 High-level output voltage Voltage gain 1 VOL1 VOL2 VOH Av1 S1, S2, and S3: Leave unconnected., VIN = 30 dB V Av2 VIN = 30 dB V fBW
Note1
MIN. 1.1
TYP. 1.5
MAX. 1.9
Unit mA
Without external pull-up resistor With external 10-k pull-up resistor connected
- - 4.8 70
0.05 0.10 5.0 80
0.4 0.5 - 86
V V V dB
PC2807
Voltage gain 2
, f 37.9 kHz 72 82 88 dB
S1, S2, and S3: Leave unconnected.,
Note1
PC2807A
BPF bandwidth
, f = 40.0 kHz 1.5 3.0 4.5 kHz
Note1
-3 dB bandwidth. S1, S2, S3: Leave unconnected., VIN = 30 dB V
Output pulse width 1
tBW1
S1, S2, and S3: Leave unconnected., VIN = 500 Vp-p, f = 37.9 kHz
Note3
400
600
800
s
,
Note2
Burst length: 600 s, Cycle: 1.2 ms
Average value of output from start of signal input to 60th pulse Output pulse width 2 tPW2 S1, S2, and S3: Leave unconnected., VIN = 50 mVp-p, f = 37.9 kHz
Note3
400
600
800
s
,
Note2
Burst length: 600 s, Cycle: 1.2 ms
Average value of output from start of signal input to 60th pulse
Notes 1. 2.
30 dB V = 31.6 V r.m.s. Input the following burst signal.
37.9-kHz carrier
600 s 600 s 600 s
3.
f = 37.9 kHz for the PC2807. In the PC2807A, measurement is at f = 40.0 kHz.
Data Sheet S13198EJ1V0DS00
5
PC2807, 2807A
APPLICATION CIRCUIT EXAMPLE (at carrier frequency of 37.9 kHz)
5V
+
6 VCC ABLC IN 9 PIN Photodiode I/V First-stage Limiter amplifier amplifier TRAP BPF
3 PAD1
Waveform-shaping circuit 22 k OUTPUT 5 OUT
Detector
Carrier elimination TRAP skip Trimming circuit fO setting
PAD6
PAD5
PAD4
PAD3
S3 4
S2 2
S1 1
GND2 8 7
GND1
13
12
11
10
Remark f = 37.9 kHz for the PC2807. In the PC2807A, f = 40.0 kHz.
6
Data Sheet S13198EJ1V0DS00
PC2807, 2807A
NOTES FOR BiCMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note:
Strong electric field, when exposed to a device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS Note:
No connection for device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. Input levels of devices must be fixed high or low by using a pull-up or pulldown circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF BiCMOS DEVICES Note:
Power-on does not necessarily define initial status of device. Production process of BiCMOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
Data Sheet S13198EJ1V0DS00
7
PC2807, 2807A
* The information in this document is current as of May, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4

▲Up To Search▲

Price & Availability of UPC2807

	To Download UPC2807 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .